一些应用可以从特殊产品或解决方案中获益。配备处理电路板的独特固定器以及各类研磨盘和研磨粉。
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PC-Met Precision Wiring Board Accessory
- High volume printed wiring board preparation system for use with EcoMet 300 and AutoMet 250/300 Power Head
- Prepares up to 36 coupons simultaneously
- Prepares reproducible cross-sections of through-holes down to 0.008”
| Part Number | Description |
|---|---|
| 60-5090 | PC-Met套件 |
| 60-5053 | PC-MET附连测试版插针 1000件 |
| 60-5067 | 杯状外部上镶嵌模-6件 |
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PWB-Met Small Hole Accessory
- High volume printed wiring board preparation system for use with EcoMet 300 and AutoMet 250 Power Head
- Prepares up to 18 coupons simultaneously
- Prepares reproducible cross-sections of through-holes down to 0.004"
| Part Number | Description |
|---|---|
| 60-5175 | PWB Met套件 |
| 60-5186 | PWB Met短插针机构 |
| 60-5084 | PWB Met插针 |
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FibrMet Discs
- FibrMet Abrasive Discs are for fine grinding applications on glass, epoxy, or polymers and produces a fine surface finish.
- 50/pack
| Color | Micron | Material |
4"[102mm] PSA Backed |
8"[203mm] PSA Backed |
12"[305mm] PSA Backed |
|---|---|---|---|---|---|
| 0.3 µm | Al2O3 | 69-3104 | 69-3174 | 69-3124 | |
| 1 µm | Al2O3 | 69-3103 | 69-3173 | 69-3123 | |
| 3 µm | Al2O3 | 69-3102 | 69-3172 | 69-3122 | |
| 9 µm | Al2O3 | 69-3101 | 69-3171 | 69-3121 | |
| 12 µm | Al2O3 | 69-3100 | 69-3170 | 69-3120 |
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Abrasive Powders
- Abrasive Powders are for fine grinding on cast iron, tin, or cloth-covered platens. They should be mixed with distilled water to achieve desired consistency.
- 5lb [2.3kg] containers
| Material |
Grit Size ANSI[FEPA] |
Micron | Part Number |
|---|---|---|---|
| Silicon Carbide | 120 [P120] | 127 µm | 40-6400-120-080 |
| Silicon Carbide | 240 [P280] | 52 µm | 40-6405-240-080 |
| Silicon Carbide | 320 [P400] | 35 µm | 40-6407-320-080 |
| Silicon Carbide | 400 [P800] | 26 µm | 40-6410-400-080 |
| Silicon Carbide | 600 [P1200] | 15 µm | 40-6415-600-080 |
| Silicon Carbide | 1000 [P2000] | 10 µm | 40-6418-000-080 |
| Aluminum Oxide | 400 [P800] | 26 µm | 40-6425-400-080 |
| Aluminum Oxide | 600 [P1200] | 15 µm | 40-6430-600-080 |
| Aluminum Oxide | - | 13 µm | 40-6612-125-080 |
| Aluminum Oxide | - | 10 µm | 40-6609-095-080 |
| Aluminum Oxide | - | 5 µm | 40-6605-050-080 |
| Aluminum Oxide | - | 3 µm | 40-6603-030-080 |
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UltraPrep Lapping
- UltraPrep Diamond Lapping Films are for fine grinding of hard materials such as ceramics. They provide a fine surface finish and gentle material removal.
- 5/pack
| Color | Micron |
8"[203mm] PSA Backed |
8"[203mm] Plain Backed |
|---|---|---|---|
| 0.1 µm | 15-6791 | 15-6792 | |
| 0.5 µm | 15-6795 | 15-6796 | |
| 1 µm | 15-6801 | 15-6802 | |
| 3 µm | 15-6803 | 15-6804 | |
| 6 µm | 15-6806 | 15-6807 | |
| 9 µm | 15-6809 | 15-6810 | |
| 15 µm | 15-6815 | 15-6816 | |
| 30 µm | 15-6830 | 15-6831 |
相关产品
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Downloadables - 产品支持
- Polsihing Application Guide
